Message from the Chair
On behalf of the ISPSD conference organizing committee, it is my great honor and pleasure to welcome you to the 32nd IEEE International Symposium on Power Semiconductor Devices and ICs. ISPSD brings together the world’s foremost experts and leading companies on power semiconductor devices and integrated circuit technology. Since the first meeting held in Tokyo in 1988, ISPSD has become the premier international forum for technical discussions on all aspects of power semiconductor devices and integrated circuits with an annual attendance of about 500 engineers, scientists and students. The conference location is rotating each year among Japan, North America, Europe and Other Areas.
In 2020 the conference is returning to Europe, namely into one of its cultural centers, Vienna, the capital of Austria. The intended venue was Hofburg, the former principal imperial palace of the Habsburg dynasty rulers and today the official residence and workplace of the Federal President of the Republic of Austria.
But: As you all know many plans for 2020 have become obsolete by the appearance of the Covid-19 pandemic. We all have been impacted by it one way or another, so I hope that all of you have been able to manage the crisis well so far and I wish the best for your families and beloved ones.
I know that all of you were looking forward to meeting friends and colleagues in person for an intense week of sharing latest news and ideas in a great city and historic surrounding. However, although many countries had recovered already pretty well, there are still many others with even increasing numbers of Corona cases at the time of this writing and we did not want to put your health at risk by gathering an international audience for a multi-day event facing a potential second wave. For those reasons we decided with a heavy heart but fully supported by the Advisory Board of the ISPSD to go for a pure virtual conference, a first time in the history of ISPSD.
The new virtual conference format will combine daily live streams, exhibitions and Q&A sessions during short and manageable time slots to facilitate real time exchange with and within the international expert audience. To manage the high number of papers the conference was extended to five days with two parallel tracks including a poster day with three sessions also running in two tracks. Later on-demand access to the presentations will be given for those who could not join live or want to listen to a missed parallel session. The conference will also offer an exciting and educative Short Course on Sunday, September 13th.
I would also like to thank our generous sponsors for their donations to enable this conference and our exhibitors complementing the peer-reviewed technical program with cutting-edge technology on display in diﬀerent areas relevant for the power semiconductor community, including wide bandgap semiconductor devices, substrates and epitaxy solutions, clean room manufacturing tools, foundry technologies, simulations tools, electrical test and failure analysis tools, as well as passive application components. Take the chance to visit their virtual stands and connect to them in a chat to learn more about their exciting offerings.
Finally, I would like to thank the ISPSD2020 Organizing Committee, the Technical Program Committee and the Advisory Committee for their contributions, support and personal dedication to master all the additional challenges imposed on us by Covid-19 and of course to all authors for laying the groundwork for the exciting technical program ahead of us!
Dr. Oliver Häberlen
General Chair, ISPSD 2020